Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...
Lam Research Advances Next Generation 3D Memory Manufacturing with Revolutionary New Etch Technology
Vantex™ redefines high aspect ratio etching with new innovations in technology and Equipment Intelligence® enabling chipmakers to progress 3D NAND and DRAM roadmaps FREMONT, Calif., Jan. 27, 2021 ...
A new cryogenic plasma etching technique developed by Japanese researchers dramatically accelerates semiconductor fabrication ...
WILMINGTON, Mass.--(BUSINESS WIRE)-- Onto Innovation Inc. (NYSE: ONTO) today announced the first customer acceptance and purchase of its new product, the Aspect® System, at one of the top three memory ...
In what it called a “leap forward” in deep trench etch nanomanufacturing technology, semiconductor capital equipment giant Applied Materials Inc. today announced the debut of its Centura Mariana ...
FREMONT, Calif., July 31, 2024 /PRNewswire/ -- Lam Research Corp. (Nasdaq: LRCX) today extended its leadership in 3D NAND flash memory etching with the introduction of Lam Cryo™ 3.0, the third ...
Each generation of 3D NAND packs about 30% more bits than the previous version, with current devices storing up to 2 terabits of data in a die the size of a fingernail. With new product introductions ...
Wide bandgap semiconductor materials are highly useful in power electronics due to their ability to work at high temperatures, power, and frequency. Gallium nitride (GaN) is a wide bandgap ...
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