PITTSBURGH, Sept. 29, 2014 /PRNewswire/ -- ANSYS announced today that its RedHawk(TM) and Totem(TM) products are certified for TSMC 16-nanometer (nm) FinFET+ (N16FF+), a second-generation FinFET ...
Ansys® Redhawk-SC™ and Ansys® Redhawk-SC Electrothermal™ multiphysics power integrity and 3D-IC thermal integrity platforms are certified as compliant with TSMC's 3Dblox standard for 3D-IC design ...
Ansys RedHawk-SC™ and Ansys Totem™ power integrity signoff platforms and Ansys HFSS-IC™ Pro electromagnetic simulation software are certified for Intel's 18A transistor process technology Ansys and ...
FinFET technology is a three-dimensional transistor architecture that results in higher-performing and lower power chips used in mobile, computing and networking applications. Designs implemented ...
" Ansys' suite of multiphysics simulation tools instill confidence in our customers, ensuring their semiconductor systems achieve the highest levels of thermal, signal, power, and mechanical integrity ...
(NASDAQ: ) has collaborated with TSMC to certify that Ansys RedHawk-SC™ and Ansys® Redhawk-SC Electrothermal™ are compliant with TSMC's 3Dblox™ standard for the exchange of design data between ...
Ansys has announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of ...
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