The main goal of the LCP circuit technology development was to provide a high-speed, high-density alternative to conventional printed circuit fabrication techniques. As semiconductor and electronics ...

Key Points Increased position by 51,967 shares in calendar Q3 2025, with an estimated trade value of $5.50 million based on ...

RIT recently completed a weeklong training in integrated circuit fabrication technology in support of Finger Lakes Economic Development initiatives. The training about semiconductor industry processes ...

Following trend towards miniaturization, IC manufacturers are under constant pressure to increase the density of interconnects, with the result that conductors with finer lines and spaces are required ...

Since their discovery, carbon nanotubes have fascinated many researchers due to their unprecedented properties. However, a major drawback in utilizing carbon nanotubes for practical applications is ...

Choosing a circuit material for a high-frequency printed-circuit board (PCB) is generally a tradeoff, often between price and performance. But PCB materials are also selected by two key factors: how ...

Rochester Institute of Technology is upgrading its Semiconductor and Microsystems Fabrication Laboratory (SMFL) to further advance the university’s research in integrated photonics, quantum ...