Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Fueled by booming demand for advanced packaging like CoWoS, a new report from China’s Wallstreetcn is turning heads with claims of a breakthrough “CoWoP” (Chip on Wafer on PCB) tech—mounting chips ...

As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief executive ...

In a new report from TrendForce, the next-gen Blackwell AI GPU platform that includes the B200 and B100 AI GPUs -- as well as the GB200, which also features NVIDIA's in-house Arm-based Grace CPU -- ...

Nvidia has placed additional orders for AI chips that require TSMC's CoWoS (chip on wafer on substrate) packaging, according to industry sources. Nvidia has recently obtained TSMC's commitment to ...

Thanks to the AI tsunami, demand for AI chips from all sectors is continuing to surge. The Chip-on-Wafer-on-Substrate (CoWoS) architecture that dominates existing 2.5D and 3D packaging technologies is ...

In brief: The world's leading semiconductor foundry, TSMC, isn't resting on its laurels. At its recent symposium for North American customers, the chipmaker unveiled ambitious roadmaps for both chip ...