The success of MEMS devices often relies on maintaining a hermetic environment to protect their delicate internal components. Glass sealing provides a superior solution for achieving reliable hermetic ...

This product marks a significant milestone for AGY, as L-HDI completes the company’s AI-focused glass fibre portfolio, which now includes a full range of solutions optimised for the semiconductor, ...

As a package substrate, the benefits of glass are substantial. It’s extremely flat with lower thermal expansion than organic substrates, which simplifies lithography. And that’s just for starters.