The project seeks to repurpose by-products such as wheat straw and sugarcane residue into paper mailers.

LAS VEGAS, NV, UNITED STATES, January 20, 2026 / EINPresswire.com / — CIT (CEO Seung Jeong) announced its participation in ...

Investments in automation and additional tools for data analytics keep coming to packaging lines as plants become more connected. Machine learning and digital twin technology are increasing throughput ...

Silicon Box is an advanced semiconductor packaging company, specializing in cutting-edge integration technology and manufacturing processes. We offer solutions that enable chiplet architecture, as ...

Revolutionary film technology from Envalior and PerfoTec extends fresh produce shelf life fourfold using natural atmosphere control ...

European tech company Fresh Inset introduces its Vidre+ Complex application in the US, which is designed to extend produce freshness, quality, appearance and nutrient value, without disrupting brands’ ...

Agreement builds on existing collaboration between the two companies for the joint development of 2nm node technology Over the years, IBM has accumulated R&D and manufacturing technologies for ...

TSMC has continued to ramp up investment in advanced packaging. According to Commercial Times, alongside its transition to a ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

South Korean foundry SK Key Foundry and semiconductor packaging and testing specialist LB Semicon have jointly developed "Direct RDL," a key semiconductor packaging technology that promises to advance ...

Q4 2025 Management View Group COO Tien Wu outlined a multiyear outlook, emphasizing that "the AI server cycle continues, primarily led by hyperscaler and the data center development." Wu reported that ...

Texas Instruments (TI) Inc. has unveiled six new power modules that deliver benefits in power density, efficiency and thermal performance, while reducing size and electromagnetic interference (EMI).