In response to the rising focus on sustainable manufacturing practices and corporate social responsibility, there has been a surge of interest in adopting environmentally friendly and green chemicals ...
A research team has developed the world's first eco-friendly silver (Ag) plating technology using a phosphorus (P) compound as a key plating component. This breakthrough technology enables silver ...
Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...
Through-silicon vias (TSVs) are crucial to the heterogeneous integration of multi-functional chiplets, providing high-performance vertical interconnects between different device layers. In this work, ...
Johnstech International has announced the release of its new Low-Force XL contacts for Pad ROL100A Series and Pad ROL200 Series test contactors for testing NiPdAu IC packages. The new contactors offer ...
Wireless consumer devices such as tablet PCs, smart phones and e-book readers are ever increasing in popularity and there are continual demands for further enhancements. Over the years, the ...
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