SAN MATEO, Calif. Ziptronix, a startup spun from the Research Triangle Institute (Research Triangle Park, N.C.) will introduce a new “engineered substrate” material Tuesday (Sept. 9) for use in ...
DUBLIN, Nov. 6, 2019 /PRNewswire/ -- The "Global Semiconductor Silicon Wafer Market" report has been added to ResearchAndMarkets.com's offering. This report forecasts the market for compound ...
“In response to market needs for more sophisticated integration processes for combining materials with different coefficients of thermal expansion, we have developed a revolutionary process technology ...
A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics.
ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...
This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...
When infrared technology wasn t enough, pulsed ultrasound found the cause of leaky MEMS tubes. An early and critical step in microelectromechanical system (MEMS) production is the bonding of two ...
TOKYO--(BUSINESS WIRE)--OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the ...
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