Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and ...

SDVs are booming, but designing hardware that can run software updates a decade in the future is a huge challenge.

The international standard has been proven effective in automotive functional safety and has begun to spread to other markets ...

To tackle these reliability challenges, IC designers are increasingly embracing a “shift-left” mindset, where reliability ...

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, ...

TLP headers in PCIe 6.0; AL/ML in functional verification; generative AI pilot; virtual twins for semi R&D; III-V tech.

Deep UV microLED for maskless lithography; avalanching nanoparticles for optical computing; Probabilistic computing with stochastic spintronics.

Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and MEMS in ...

Source Heterogeneous SoCs for AI: The PULP Platform Experience” was published by researchers at University of Bologna.

Next-gen EUV laser R&D; $285M CHIPS Act award; U.S. microelectronics research centers; Synaptics-Google deal; maskless microLED DUV; Micron's $2B fab expansion; Tesla sales slump; USB-C mandate in ...

Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle ...